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Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
Program Year/Program:
2014 / SBIR
Agency Tracking Number:
F112-057-1506
Solicitation Year:
2011
Solicitation Topic Code:
AF112-057
Solicitation Number:
2011.2
Small Business Information
ThermAvant Technologies, LLC
1000 A Pannell Street Columbia, MO -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2014
Title: Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics
Agency / Branch: DOD / USAF
Contract: FA9453-13-C-0029
Award Amount: $742,600.00
 

Abstract:

ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to transform high heat flux (e.g. 100-300W/cm2) at the device package to a lower heat flux at the heat sink areas - and do so with minimal thermal resistance. Deliverables at conclusion of two-year effort will include a demonstration OHP-based chip carrier prototype attached to simulated real chip(s) on test board with integrated heat sink. BENEFIT: The expected benefit of this proposed Phase II effort is the deployment of higher power processors aboard satellite payloads. Such an enabling technology will be applicable commercial and military satellite applications, as well as terrestrial ones with ultra-high heat flux and/or constrained heat rejection rates.

Principal Investigator:

Peng Cheng
Senior Thermal Engineer
(888) 415-7306
peng.cheng@thermavant.com

Business Contact:

Joe Boswell
President
(888) 415-7306
joe.boswell@thermavant.com
Small Business Information at Submission:

ThermAvant Technologies, LLC
1000 A Pannell Street Columbia, MO -

EIN/Tax ID: 261248850
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: Yes