INDIANA INTEGRATED CIRCUITS LLC

This project will design analog and digital CMOS circuits for cryogenic operation. Power dissipation is the greatest challenge facing the development of electronic systems today.  Both passive (leaka ...

The team of Indiana Integrated Circuits, LLC (IIC), and Calumet Electronics Corporation (CEC) propose the development and demonstration of an innovative approach for modularized, highly-scalable, high ...

Indiana Integrated Circuits, LLC (IIC) and the University of Notre Dame, proposes to design, fabrication, and test/verification of an adiabatic reversible-logic microprocessor, building upon a very pr ...

Adiabatic reversible logic provides a way to dramatically reduce power dissipation by recovering the energy used to encode information, rather than dissipating the energy to heat, as is done in conven ...

This proposal would develop the next generation of interconnects and assembly technology by making use of Quilt Packing® (QP) interconnects for the integration of semiconductor chips to extend system ...

Indiana Integrated Circuits, LLC (IIC) proposes to develop the customizable, high-performance microchip interconnect technology called Quilt Packaging (QP) to address NASA's requirement for high perfo ...

ABSTRACT: Improvements such as increased array size and better non-uniformity correction have been made to resistive emitter arrays fabricated on silicon (Si). There exist additonal wavelengths of in ...