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Design and Fabrication Techniques for 3-Dimensional Integrated Circuits
Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: HR0011-10-9-0011
Agency Tracking Number: 09SB1-0133
Amount:
$750,000.00
Phase:
Phase II
Program:
SBIR
Solicitation Topic Code:
SB091-008
Solicitation Number:
2009.1
Timeline
Solicitation Year:
2009
Award Year:
2010
Award Start Date (Proposal Award Date):
2010-08-30
Award End Date (Contract End Date):
2012-08-29
Small Business Information
5821 Sky Park Dr.
Plano, TX
-
United States
DUNS:
828058508
HUBZone Owned:
No
Woman Owned:
Yes
Socially and Economically Disadvantaged:
Yes
Principal Investigator
Name: Nisha Checka
Title: CEO/Founder
Phone: (617) 500-5481
Email: nisha@goofyfootlabs.com
Title: CEO/Founder
Phone: (617) 500-5481
Email: nisha@goofyfootlabs.com
Business Contact
Name: Nisha Checka
Title: CEO/Founder
Phone: (617) 500-5481
Email: nisha@goofyfootlabs.com
Title: CEO/Founder
Phone: (617) 500-5481
Email: nisha@goofyfootlabs.com
Research Institution
N/A
Abstract
The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applications in the system on a chip design space. Currently, CAD tools for 3-D integration are severely lacking stagnating potentially explosive growth of the technology. GoofyFoot Labs proposes TESI3d, a CAD tool to efficiently and accurately explore the complex 3-D design space. We will develop a full-scale prototype, which will then be used to design and evaluate 3-D systems.
* Information listed above is at the time of submission. *