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Indium Surface Preparation for Improved Flip-Chip Hybridization

Award Information

Agency:
Department of Defense
Branch:
Army
Award ID:
97830
Program Year/Program:
2010 / SBIR
Agency Tracking Number:
A101-017-0573
Solicitation Year:
N/A
Solicitation Topic Code:
ARMY 10-017
Solicitation Number:
N/A
Small Business Information
Advanced Research Corporation
4459 White Bear Parkway White Bear Lake, MN -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2010
Title: Indium Surface Preparation for Improved Flip-Chip Hybridization
Agency / Branch: DOD / ARMY
Contract: W909MY-10-C-0041
Award Amount: $69,930.00
 

Abstract:

For IR sensors, the sensing detector and readout circuitry (ROIC) are commonly joined on a pixel by pixel level in a process referred to as Hybridization. Hybridization requires bonding an ROIC die and a detector die on a pixel level, where the total number of pixels required to bond and form interconnects ranges from 1,000,000 to 16,000,000 individual pixels. The material of choice for Hybridization is Indium, and the properties of Indium and Indium Oxide play an essential and critical role. Indium Oxide, a ceramic semiconducting material forms naturally in ambient air. This process is thermodynamically favored and occurs spontaneously; therefore all Indium material in ambient air will have a natural layer of Indium Oxide. In order to form adequate electrical contacts during Hybridization, this native Indium Oxide needs to be removed and the Indium passivated to prevent oxide growth. The subject of this proposal is to develop such a solution.

Principal Investigator:

Greg Wagner
CTO
6517899000
gwagner@arcnano.com

Business Contact:

Judith Dugas
CFO
6517899000
jdugas@arcnano.com
Small Business Information at Submission:

Advanced Research Corp.
4459 White Bear Parkway White Bear Lake, MN 55110

EIN/Tax ID: 411563821
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No