BOND-M: Bond Observation and Non-Destructive Measurement Technique
Agency / Branch:
DOD / DARPA
ScienceTomorrow proposes to develop a novel Bond Observation and Non-Destructive Measurement (BOND-M) technique for measuring bond strength of adhesively joined composites. BOND-M will employ high-intensity focused ultrasound stress waves directed at a small region within the adhesive layer to rapidly proof test the bond while simultaneously observing for bond damage and defects and verifying successful bonding. The BOND-M device, positioned on a surface, can steer the focused beam to proof test the bond at multiple locations deep inside or on the edge of the composite structure. By traversing the device parallel to the longer dimension of a composite primary structure, entire bond-joints can be tested rapidly. Local quantitative bond strength measurement can be used for process control and monitoring. Validation of the bond strength measurement will be accomplished by employing a destructive method on identical samples. BOND-M measurement with a statistical sampling scheme will enable rapid aviation certification while maintaining the structural integrity of composites and helping to prevent surprise failures.
Small Business Information at Submission:
PO Box 7562 Woodbridge, VA -
Number of Employees: