High-Density Optical Interconnects
To address the DARPA need to resolve the interconnect performance limitations in next-generation electronics, Physical Optics Corporation (POC) proposes to develop a new Optical Nanoscale Interconnect (ONSET), based on space-efficient optical waveguide on-chip data communications. The innovation in the interconnect design and waveguide material, as well as optimized operating frequency, will enable the ONSET technology to improve the global data transfer rate and reduce heat dissipation in complex integrated circuits. As a result, the ONSET offers a potentially significant increase in performance and decrease in power consumption in next-generation microelectronics, which directly address the DARPA requirements. In Phase I, POC will demonstrate the feasibility of the ONSET technology by modeling and simulation, providing the required confinement for on-chip integration with<10 dB/cm propagation loss, with attention to manufacturability and compatibility with existing standard integrated circuit fabrication processes. In Phase II, POC plans to develop prototype optical interconnects and demonstrate their performance including propagation losses<20 dB/cm.
Small Business Information at Submission:
Director, Advanced X-ray Technology
Chief Financial Officer
Physical Optics Corporation
Photonic Systems Division 1845 West 205th Street Torrance, CA -
Number of Employees: