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Compact, Rugged, Flexible Fiber Optic Interferometer for Sensitive Gas and P

Award Information
Agency: Department of Defense
Branch: National Geospatial-Intelligence Agency
Contract: N/A
Agency Tracking Number: 32132
Amount: $739,743.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1998
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
1555 Doolittle Dr., Suite 100
San Leandro, CA 94577
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Gary Rondeau
 (510) 483-4156
Business Contact
Phone: () -
Research Institution
N/A
Abstract

Alameda Applied Sciences Corporation (AASC) proposes to develop a new type of interferometer that is compact and portable and can be used to make in-situ measurements of gases and plasmas. This interferometer uses polarization maintaining optical fibers and diode lasers to duplicate the capabilities of existing Mach-Zender interferometers that use dicrete optical elements such as mirrors, lenses and prisms, but in a more compact, rugged and flexible assembly. Our basic design to measure the density outside supersonic nozzles (like those used on x-ray simulators) consists of an assembly that measures 19" x 22" x 8", including the laser, probe and reference beams, feedback network to balance the two interferometer legs and detector electronics. Such a package is portable and readily adapted for use in-situ in various DNA simulators and Plasma Opening Switch testbeds. More importantly, after this Fiber Optic Interferometer has been validated for simulator applications, it could find broader use as a sensitive, non-invasive density diagnostic in chemical reactors, jet exhausts, pulsed ion beam diodes, accelerators and other situations where neutral gases and plasmas are present. The instrument will be validated in Phase I, followed by commercial insertion at the end of Phase-II.

* Information listed above is at the time of submission. *

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