"R3 Logic, Incorporated proposes to perform a comprehensive study to develop a fullsuite of computer-aided design tools for three-dimensional circuit integration. Thecompany will build on its existing tool set that enables 3-D physical layout andverification and will develop recommendations for… More

"3D-IC proposes to develop design specifications for a 12 megapixel 1000 frame / second digital output imager. The proposed design will be based on using a monolithic substrate for the photosensor array that is engineered to achieve high quantum efficiencyand good spectral response in visible light.… More

"R3 Logic, Incorporated proposes to develop a high-resolution, 12M-pixel 1000 frame / s imager to meet the Army's digital imaging needs for weapons test and evaluation. Through this program, R3 Logic will not only build and demonstrate a high-resolutionimager, but will formulate a new methodology… More

R3 Logic proposes to develop an openly accessible Design Environment that will incorporate CAD tools needed for the analysis and design of 3D integrated circuits, including schematic capture, VHDL interfaces, 3D physical layout, verification, 3D parasiticextraction, interactive coupled… More

R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and… More