Computer-Aided Design Tools for Three-Dimensional Circuit Integration
Agency / Branch:
DOD / DARPA
"R3 Logic, Incorporated proposes to perform a comprehensive study to develop a fullsuite of computer-aided design tools for three-dimensional circuit integration. Thecompany will build on its existing tool set that enables 3-D physical layout andverification and will develop recommendations for extending these tools to permitanalyses of 3-D circuit performance, including thermal and electromagnetic effects,to perform automated place and route, and to interface with automated tools fortop-down design and circuit synthesis from behavioral models. The proposed studywill focus on methodology and algorithmic development. In Phase II we will proposeto implement the recommendations of this study. The development of a powerful set of 3-D design and modeling tools is critical topromoting the advancement of three-dimensional circuit technology in thesemiconductor industry. 3-D circuits cannot be implemented without a 3-D processtechnology; and 3-D process technologies will not be available until there areoverwhelmingly convincing reasons to put them in place. The major benefit ofdeveloping modeling tools for 3-D circuit performance will be in providingquantitative demonstrations of the improvements achievable through multi-layerstacking and vertical interconnection. It will also ease the transition of VLSIdesigners into a 3-D world by providing examples of existing circuits optimizedfor 3-D."
Small Business Information at Submission:
11 Ward Street, Suite 400 Somerville, MA 02143
Number of Employees: