A High Resolution, Ultra High Frame Rate Visible Light Imager for High Speed Digital Photography

"3D-IC proposes to develop design specifications for a 12 megapixel 1000 frame / second digital output imager. The proposed design will be based on using a monolithic substrate for the photosensor array that is engineered to achieve high quantum efficiencyand good spectral response in visible light. The company proposes to investigate adaptation of its proprietary pixel-parallel processor core architecture to enable the required high bandwidth data read out in this Phase I study. It will also investigaterequirements for the interface camera and propose a suitable camera system architecture. High speed photographic systems are used for many purposes, including ballistics testing, industrial inspection, security, law enforcement, and medical applications.Market research in the domain of high-end imaging applications shows that the demand for these products will exceed $200M/year by 2004 in unit sensor costs. Digital imaging techniques, will significantly improve the quality of high speed photography. Theywill allow faster, more automated analysis of the available information, and will eliminate the cost and time needed to process film."