Ultra-Dense Three-Dimensional Electronics for Space
Agency / Branch:
DOD / USAF
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron's patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron's 3-D process to fabricate a prototype device.
Small Business Information at Submission:
30 Fuller Rd. Lexington, MA 02420
Number of Employees: