A novel micro-channel heat exchanger for high heat flux electronics

In this Phase I STTR program, a team consisting of Advanced Ceramics Research Inc. (ACR) and the University of Arizona (UA) propose to develop and optimize a novel, low-cost, integrated micro-channel heat exchanger system for high power electronicapplications. In radar and other applications involving power electronics, thermal dissipation from the electronics approach levels as high as 1000 W/cm2. In the proposed work, ACR and UA will use their patented extrusion freeform fabrication (EFF) rapidprototyping technology to fabricate micro-channel heat exchangers with optimized channel sizes to dissipate up to 1000 W/cm2 under two-phase (boiling) flow conditions. UA will test and analytically model the milli-and micro-channel heat exchangers intwo-phase (boiling) flow in order to assess the overall heat transfer coefficient of candidate geometries of heat exchangers and optimize their configuration to obtain thermal dissipation approaching levels as high as 1000 W/cm2 and demonstrate that themaximum temperature will rise to less than 125¿F at the junction level. This can then be used in both passive and actively pumped cooling systems. Improved cooling techniques are required for reliable electronics with current trends toward increasedpackaging densities and higher power levels for applications such as aircraft avionics, electric power systems, radar and weapon systems.