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Wafer-Wafer Transfer for Packaging and Assembly of MEMS

Award Information

Agency:
Department of Defense
Branch:
Defense Advanced Research Projects Agency
Award ID:
41306
Program Year/Program:
1998 / SBIR
Agency Tracking Number:
41306
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Advanced Cmp Products, Inc.
825 Buckley Road San Luis Obispo, CA 93401
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1998
Title: Wafer-Wafer Transfer for Packaging and Assembly of MEMS
Agency / Branch: DOD / DARPA
Contract: N/A
Award Amount: $99,000.00
 

Abstract:

The objective of this proposal is to demonstrate the feasibility of vacuum micro-packaging for devices such as MEMS gyroscopes and accelerometers. Vacuum is critical for high Q-factor, surface-micromachined MEMS. Robust, low-cost solutions are needed for applications such as guided munitions and unattended sensors. Proposed work focuses on long-term reliability issues, such as outgassing, permeation, and metallization stability. In addition, scale-up from our current chip-scale process to wafer-scale will constitute a key proof-of-concept.

Principal Investigator:

Michael Cohn
8057825453

Business Contact:


0
Small Business Information at Submission:

ADVANCED CMP PRODUCTS, INC.
825 Buckley Road San Luis Obispo, CA 93401

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No