Wafer-Wafer Transfer for Packaging and Assembly of MEMS

Award Information

Agency: Department of Defense	Branch: Defense Advanced Research Projects Agency	Award ID: 41306	Program Year/Program: 1998 / SBIR
Agency Tracking Number: 41306	Solicitation Year: N/A	Solicitation Topic Code: N/A	Solicitation Number: N/A

Small Business Information: Advanced Cmp Products, Inc.
825 Buckley Road San Luis Obispo, CA 93401
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Woman-Owned: No

Minority-Owned: No

HUBZone-Owned: No

Phase 1: Fiscal Year: 1998

Title: Wafer-Wafer Transfer for Packaging and Assembly of MEMS

Agency / Branch: DOD / DARPA

Contract: N/A

Award Amount: $99,000.00

Abstract:
The objective of this proposal is to demonstrate the feasibility of vacuum micro-packaging for devices such as MEMS gyroscopes and accelerometers. Vacuum is critical for high Q-factor, surface-micromachined MEMS. Robust, low-cost solutions are needed for applications such as guided munitions and unattended sensors. Proposed work focuses on long-term reliability issues, such as outgassing, permeation, and metallization stability. In addition, scale-up from our current chip-scale process to wafer-scale will constitute a key proof-of-concept.

Principal Investigator:
Michael Cohn
8057825453

Business Contact:

0

Small Business Information at Submission:

ADVANCED CMP PRODUCTS, INC.
825 Buckley Road San Luis Obispo, CA 93401

EIN/Tax ID:

DUNS: N/A

Number of Employees:

Woman-Owned: No

Minority-Owned: No

HUBZone-Owned: No