1024 x 1024 Snapshot Two-Color Infrared Focal Plane Array (FPA) for Air-to-Ground Applications
Agency / Branch:
DOD / NAVY
We propose to develop "High Performance, Large Format Mid-Wave Focal Plane Arrays on Type II Strained Layer Superlattice (SLS) Material". The Innovative Features of the project are: Detector Arrays on Type II SLS Material. High Performance Detector Arrays are designed on Type II SLS material. The Type II Detector has several advantages as compared to Type I HgCdTe and InSb Detectors. The advantages are: 1) higher performance due to longer minority carrier lifetime, 2) higher operating temperature due to low dark current, 3) wide range of spectral bands (SWIR, MWIR, LWIR, VLWIR), 4) very fast time response and 5) lower cost due to higher array uniformity and low cost large area substrate. Large Format MWIR FPA. 1024 x 10-24 element focal plane array with pixel size = 19.5 um x 19.5 um are designed for MWIR (3-5 um) waveband. The 1024 x 1024 element detector array is integrated with an existing ROIC with snapshot integration capability. High Reliability Passivation Scheme. The detector array is fabricated with high reliability radiation-hard passivation scheme. High Operating Temperature. The focal plane array can be operated at Uncooled (300K), thermo-electrically (T.E.) cooled (160K-250K) and cryogenic cooled (77K) temperature levels. Cost-Effective Product Development. The proposed product can be developed cost-effectively with reduced risk due to: 1) feasibility of fabricating of high performance, high temperature MWIR SLS detectors have already been demonstrated during Phase I of the contract, 2) snap-shot 1024 x 1024 element ROICs have already been developed and are available on the commercial market, 3) ADT is presently developing SLS products under an on-going Army/SMDC contract for a BAA solicitation. Several of the tasks that are being conducted under this contact are directly applicable to the proposed project. During Phase II, 1024 x 1024 Element Focal Plane Array will be fabricated on SLS material for MWIR (3-5 um) waveband. The Focal Plane Array will be integrated into a Dewar/Cooler Assembly and delivered to NAVAIR. During Phase III, FPA/Dewar/Cooler Assembly will be integrated into Navy's LITENING Pod. An additional FPA/Dewar/Cooler Assembly will be fabricated for Navy's ATFLIR Pod, as an option. Also during Phase III, the following task will be completed: 1) Integration of 1024 x1024 element FPA/Dewar assembly into Navy Systems and demonstration of improved targeting capability, 2) Development of Dual Band (MWIR/LWIR) FPAs and 3) Integration of Dual Band FPA/Dewar Assembly in Navy Systems.
Small Business Information at Submission:
Peter J. Kannam
ADVANCED DEVICE TECHNOLOGY, INC.
4 Raymond Ave, Suite #4B Salem, NH 03079
Number of Employees: