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Company Information:

Company Name:
ADVANCED MICROMACHINES, INC.
Address:
11000 CEDAR AVENUE
Cleveland, OH 44106
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
14
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $469,932.00 5
SBIR Phase II $2,590,718.00 4

Award List:

Micromachined Silicon Temperature Extreme Sensor Requiring No Power Source

Award Year / Program / Phase:
1994 / SBIR / Phase I
Award Amount:
$100,000.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Ken Golaman
Abstract:
N/a

Microfabricated Silicon Carbide Heat Flux Sensor

Award Year / Program / Phase:
1994 / SBIR / Phase I
Award Amount:
$59,947.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Ken Goldman
Abstract:
N/a

Micromachined Silicon Temperature Extreme Sensor Requiring No Power Source

Award Year / Program / Phase:
1995 / SBIR / Phase II
Award Amount:
$375,000.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Ken Golaman
Abstract:
The objective of this research is to design a micromechanical temperature sensor capable of recording temperature extremes experienced beyond a preset value without the use of electrical power. The temperature sensor's memory will be mechanically induced. The sensor will be either in an… More

Microfabricated Silicon Carbide Heat Flux Sensor

Award Year / Program / Phase:
1995 / SBIR / Phase II
Award Amount:
$750,000.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Ken Goldman
Abstract:
The goal of this project is to develop new high-temperature heat flux sensors for heat transfer measurements in turbomachinery. The following obejctives will be pursued. Pototype sensors will be demonstrated which function at temperatures as high as 600C with a frequency response up to 50kHz. Using… More

Integrated Micromachined Angular Rate Sensor

Award Year / Program / Phase:
1996 / SBIR / Phase I
Award Amount:
$70,000.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Christopher Bang
Abstract:
N/a

Integrated Micromachined Angular Rate Sensor

Award Year / Program / Phase:
1997 / SBIR / Phase II
Award Amount:
$750,000.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Christopher Bang
Abstract:
We propose a solid-state angular based microelectromechanical systems (MEMS) technology. The rate sensor utilizes a tuning fork resonator design with control and readout electronics integrated on the dame chip as the sensor. The sensor will be designed to operate at high spin rates (300 rev/sec)… More

Conformal Strain Gage System for the Measurement of Stress in Helicopter Transmission Gears

Award Year / Program / Phase:
1997 / SBIR / Phase II
Award Amount:
$715,718.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Christopher Bang
Abstract:
We propose a conformal strain gage array to provide an improved strain measurement technology for turbomachinery and mechanical components. The array consists of MEMS sensors and electronics embedded in a flexible, compliant substrate which may be conformally applied to test components. The… More

Conformal Strain Gage System for the Measurement of Stress in Helicopter Transmission Gears

Award Year / Program / Phase:
1997 / SBIR / Phase I
Award Amount:
$140,000.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Christopher Bang
Abstract:
N/a

HIGH-PERFORMANE HEAT SINKS BASED ON MEMS TECHNOLOGY

Award Year / Program / Phase:
1998 / SBIR / Phase I
Award Amount:
$99,985.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Christopher Bang
Abstract:
We propose high-performance heat sinks based on MEMS technology for cooling of advanced electronics. Our approach combines innovative designs, new microfabrication techniques, and high conductance materials resulting in extremely low thermal resistance and high heat load capacities in a compact… More