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Novel Composites for Microelectronics Packaging Applications

Award Information

Agency:
Department of Defense
Branch:
Missile Defense Agency
Award ID:
43943
Program Year/Program:
2004 / SBIR
Agency Tracking Number:
99-684
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Allcomp Inc.
209 Puente Ave. City of Industry, CA 91746-
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2004
Title: Novel Composites for Microelectronics Packaging Applications
Agency / Branch: DOD / MDA
Contract: F33615-01-C-5003
Award Amount: $399,974.00
 

Abstract:

It makes great economical and environmental sense to recycle A/C C-C brake. Used C-C brake composites, both 2D and 3D, are available in large quantities but to date have found limited use due to their thinness and annular shape. In Phase I, we have successfully demonstrated the feasibility of using recycled C-C brake material as thermal spreaders for electronic thermal management applications. Under the proposed Phase II effort, we plan to design, fabricate and qualify electronic related thermal management products using recycled aircraft C-C brake materials. We plan to down-select and focus our initial efforts on two high-end, low volume applications ( one commercial and one military applications), where C-C offers siignificant advantages over othre competing materials. For each selected application, we plan to address all relevant technical issues and fabricate full-size prototype products for performance testing.

Principal Investigator:

Wei T. Shih
6263694572

Business Contact:

Small Business Information at Submission:

ALLCOMP, INC.
209 Puente Avenue City of Industry, CA 91746

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No