Microwave 3DIC-Microwave Three Dimensional Integrated Circuit
Agency / Branch:
DOD / USAF
The 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 technical objective is to assess the feasibility of microwave 3DIC concept and to develop a road map for the realization of practical microwave 3DICs for both commercial and military applications.
Small Business Information at Submission:
Principal Investigator:Ho C. Huang
Amcom Communications, Inc.
PO Box 179 Clarksburg, MD 20871
Number of Employees: