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Microwave 3DIC-Microwave Three Dimensional Integrated Circuit

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
36226
Program Year/Program:
1998 / SBIR
Agency Tracking Number:
36226
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
AMCOM Communications, Inc.
401 Professional Drive Suite 140 Gaithersburg, MD -
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1998
Title: Microwave 3DIC-Microwave Three Dimensional Integrated Circuit
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $749,989.00
 

Abstract:

The 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 technical objective is to assess the feasibility of microwave 3DIC concept and to develop a road map for the realization of practical microwave 3DICs for both commercial and military applications.

Principal Investigator:

Ho C. Huang
3013538400

Business Contact:


0
Small Business Information at Submission:

AMCOM COMMUNICATIONS, INC.
PO Box 179 Clarksburg, MD 20871

EIN/Tax ID: 522021225
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No