Large-Area High-Throughput Patterning System with Submicron Resolution
Agency / Branch:
DOD / USAF
In the fabrication of many electronic and opto-electronic products, such as multichip modules (MCMs), flat-panel displays (FPDs) and printed circuit boards (PCBs), it is necessary to fabricate millions of microscopic structures on a single large substrate. Large format manufacturing equiptment, therefore,plays a critical role in determining the overall cost of these productis. Over the last two decades, although the device density of ICs has doubled every 18-24 months, packaging technologies fro MCMs and PCBs have not kept pace with the progress in ICs. As a result, the overall rate of implementation of next generation microelectronic modules in computing, communications, automotive, and defense markets has been slow. In this proposal, we present a program to identify the bottlenecks impeding the progress in acceptance of next generation manufacturing equipment for MCMs due to both technology considerations and market forces. We expect that a well orchestrated, joint government-industry effort can lead to an order of magnitude reduction in manufacturing costs, development of a domestic supplier infrastructure, and acceleration of acceptance of new technologies.
Small Business Information at Submission:
Principal Investigator:Dr. Kanti Jain
250 Clearbrook Road Elmsford, NY 10523
Number of Employees: