Fabrication of Large-Area Distributed Electronic Modules
Agency / Branch:
DOD / DARPA
`How can one fabricate a sensor that can make different types of measurements on a large area, on a shape that is not known a priori, that is lightweight, that is accurate with a fine resolution, while at the same time has the resolution and sensitivity of a standalone instrument, and at an affordable cost?' This proposal will develop a process and a tool to answer this commonly asked question in military, space and commercial sensor and electronics applications. Currently available sensors can make different types of measurements with a high degree of accuracy. These are limited in that they only measure the state of either a point or a small region on the body. A technology and process that extends this capability to address the remaining constraints will be of enormous benefit to the sensor community. In this Phase II program we will create a detailed design and build a multifunctional production-worthy tool to fabricate large-area distributed electronic modules. This tool will be capable of performing lithography, photoablation and excimer laser crystallization on a single platform. In addition, we will demonstrate a suite of processes to fabricate large-area distributed electronics. In the Phase III program, we will commercialize the new multifunctional tool and the large-area sensor.
Small Business Information at Submission:
6 Skyline Drive Hawthorne, NY 10532
Number of Employees: