Carbon-carbon is a unique composite material that achieves the highest in-plane thermal conductivity and also achieves very high young's modulus (40-50 MSI). This research project will demonstrate the feasibility of C-C as an effective heat sink material for electronic packaging. Three to five… More

The objective of this project is to develop an ultralightweight high thermal conductivity printed wiring board (PWB) constraining core mad of very high thermal conductivity carbon materials to replace currently used material constraining cores, e.g. copper-invar-copper. The objective of Phase I is… More

The innovation being proposed in this project is the development of an ultra lightweight, noncontaminating dimensionally stable optical bench structural material product for small-sat applications. Candidate materials for the proposed structural material product, a sandwich structure, include:… More

The proposed innovation is a lightweight reaction wheel (RWA) support structure and housing assembly that is constructed from composite materials and which includes an integral tilt mechanism

Reconnaissance and surveillance missions, using small robust spacecraft, may require that sensors be rapidly positioned to suit the specific mission requirements. These maneuvers are most effectively conducted using a CMG with an output torque of 2-100 ft.-lbs.; however, the smallest CMG currently… More

This Phase I project is for the development of a concept that integrates a printed circuit board with a high stiffness, high thermal conductivity composite material structure to achieve a multifunctional structural electronics packaging product for spacecraft application. The project involves… More

This project will develop a chip package that can be tailored to match the thermal coefficient of expansion (TCE) of semiconductor chips and has an order of magnitude higher thermal conductivity than conventional ceramic packaging materials. The Phase I project will focus on selection and… More

This project will identify and develop new low cost high thermal performance coating systems for composite thermal management materials, particularly high conductivity carbon-carbon. Three materials/processes will be investigated including a new type of chemical vapor deposition called combustion… More

This project will identify and develop new low cost high thermal performance coating systems for composite thermal management materials, particularly high conductivity carbon-carbon. Three materials/processes will be investigated including a new type of chemical vapor deposition called combustion… More

This Small Business Innovation Research (SBIR) project will develop a low-cost resin film infusion approach to fabricating a polar woven (hoop and radial direction reinforced), lightweight composite material rotor for flywheel energy storage (FES) systems. The application of this device will be for… More

Inserting new high power sensors and electronics on the E-8 aircraft will require highly effective cooling. Diamond substrates cooled by evaporative spray techniques can satisfy requirements for both extraordinary cooling effectiveness and tailorabilityto advanced radar systems. M. S. Sehmbey et… More

This SBIR proposal is for the development of innovative packaging of radiation hardened electronics in support of Strategic Missile Guidance System upgrades for sea launched ballistic missiles (SLBMs). The Navy Strategic Systems Programs has authorizedLife extensions for the Trident Fleet Ballistic… More

This SBIR project investigated feasibility of nanostructured polymers for improving micro-electromechanical systems (MEMS) packaging for deep space harsh environments. MEMS technology enables development of spacecraft devices and subsystems that are small, low-cost, low mass, low volume, and low… More

This SBIR project investigated feasibility of nanostructured polymers for improving micro-electromechanical systems (MEMS) packaging for deep space harsh environments. MEMS technology enables development of spacecraft devices and subsystems that are small, low-cost, low mass, low volume, and low… More