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Affordable, High Performance Composites

Award Information

Agency:
Department of Defense 		Branch:
Air Force 		Award ID:
28231 		Program Year/Program:
1996 / SBIR
Agency Tracking Number:
28231 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
Applied Material Technologies, Inc.
2302 S. Fairview Street Santa Ana, CA 92704 0493
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1996
Title: Affordable, High Performance Composites
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $747,795.00
 

Abstract:

This project will develop a chip package that can be tailored to match the thermal coefficient of expansion (TCE) of semiconductor chips and has an order of magnitude higher thermal conductivity than conventional ceramic packaging materials. The Phase I project will focus on selection and development of composite materials that can be used for packages as well as generating a design of a package that uses the new materials. Various combinations of fiber and matrix materials will be analyzed, fabricated and tested to develop a material property data base. A material will be selected for further evaluation and a prototype brassboard demonstrator will be fabricated. Development of this new semiconductor package material will provide a replacement for ceramic packages (such as A1203) that are lighter in weight, better match the TCE of the silicon ships, and are better at dissipating waste heat. The heat dissipation improvement should lead to lower component temperatures and higher reliability of the semiconductor components.

Principal Investigator:

William E. Davis
7145458825

Business Contact:

Small Business Information at Submission:

Applied Material
3611 S. Harbor Blvd., Suite 225 Santa Ana, CA 92704

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No