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Multifunctional Structural Electronics Packaging

Award Information

Department of Defense
Air Force
Award ID:
Program Year/Program:
1995 / SBIR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
Solicitation Number:
Small Business Information
Applied Material Technologies, Inc.
2302 S. Fairview Street Santa Ana, CA 92704 0493
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phase 1
Fiscal Year: 1995
Title: Multifunctional Structural Electronics Packaging
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $77,471.00


This Phase I project is for the development of a concept that integrates a printed circuit board with a high stiffness, high thermal conductivity composite material structure to achieve a multifunctional structural electronics packaging product for spacecraft application. The project involves printed circuit board packaging technology combined with innovative carbon-carbon composites processing technology. In the Phase I project a design of a multifunctional structural-electronics product will be developed and subelements (6" x 6") will be fabricated and tested. Measurement of stiffness, coefficient of thermal expansion, thermal conductivity and electrical continuity will be made. The data will be used to develop a preliminary design of a spacecraft structural panel with integral electronics. This project will be coordinated with the Phillips Lab VTE and VTS divisions and it will be directed at meeting small spacecraft packaging needs as determined by the Phillips Lab Space Experiments Directorate. Martin Marietta, an eventual user of the technology, will provide support to AMT by providing spacecraft component design requirements and by sharing results of their related on-going VTS project.

Principal Investigator:

William E. Davis

Business Contact:

Small Business Information at Submission:

Applied Material
3611 S. Harbor Blvd., Suite 225 Santa Ana, CA 92704

Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No