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MEMS Packaging for Deep Space Environments Using Nano-structured Polymers

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NAS3-02177
Agency Tracking Number: 012755
Amount: $69,234.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2302 S. Fairview Street
Santa Ana, CA 92704
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 William Davis
 Program Manager
 (714) 545-8825
 wedavis@amt-i.com
Business Contact
 Lisa Wilder
Title: Business Official
Phone: (714) 545-8825
Email: lawilder@amt-i.com
Research Institution
N/A
Abstract

This SBIR project investigated feasibility of nanostructured polymers for improving micro-electromechanical systems (MEMS) packaging for deep space harsh environments. MEMS technology enables development of spacecraft devices and subsystems that are small, low-cost, low mass, low volume, and low power consumption. A Stirling powered microcooler device was studied and investigated in Phase II. MEMS devices offer improvements in spacecraft efficiencies and new mission functionalities, MEMS introduces new challenges directly related to their micro-size and solid-state structure. Space missions require devices to operate in harsh environments with extreme temperatures, debris, planetary atmospheres and electromagnetic radiation. A pervasive issue facing users of MEMS devices in all environments is the availability and design of packaging technologies for ensuring long-term reliability and performance of the devices. This project will develop packaging technologies for MEMS based on innovative polymeric materials that are processable into diamond like carbon and silicon carbide materials. Packaging benefits include:? High wear surfaces? Thermally conductive? Electrically insulating? Anti-stiction? Hard surface? Low porosity? Low coefficient of friction? CTE matched to siliconThese materials are also expected to be low in cost compared to chemical vapor deposition materials and they achieve higher purity and quality.

* Information listed above is at the time of submission. *

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