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A Low-Cost and Scalable Dielectric Films

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-07-M-2710
Agency Tracking Number: O063-EP3-1211
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: OSD06-EP3
Solicitation Number: 2006.3
Timeline
Solicitation Year: 2006
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-02-23
Award End Date (Contract End Date): 2008-02-23
Small Business Information
1801 Maple Ave. Suite 5316
Evanston, IL 60201
United States
DUNS: 020126814
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Benjamin Mangrich
 Materials Engineer
 (847) 287-6292
 bmangrich@atfinet.com
Business Contact
 Sankar Sambasivan
Title: President & CEO
Phone: (847) 287-6291
Email: sankar@atfinet.com
Research Institution
N/A
Abstract

Compact, high-energy-density capacitors will be the key enabling technology for future pulse-power weapon systems that are being pursued by the DoD. These capacitors convert steady electrical energy into short pulses that are needed to energize loads (required for directed energy weapons). There have been recent advances in chemical double layer capacitors, leading to major advances in energy storage capacity, however, there still exists major technical challenges to achieve the required power and energy density, while keeping devices small enough for practical use and lightweight requirements. In order to enable the miniaturization of these capacitors, high energy density dielectric films are needed. To address the specific need for flexible dielectric films, Applied Thin Films, Inc (ATFI) proposes a high throughput, thermally-stable, low cost, solution-based thin film with suitable dielectric properties and flexibility for use in capacitors. In Phase I, dielectric films of various configurations will be deposited on metallic substrates and subsequently tested for dielectric, thermal, and mechanical properties. Microstructural characterization will also be performed to confirm pin-hole free nature of the films. Although preliminary efforts will be employed to determine large area uniformity, scale-up to continuous lengths at relatively high speeds will be pursued in Phase II.

* Information listed above is at the time of submission. *

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