Low Cost Advanced Composite Structures
Agency / Branch:
DOD / USAF
Aspen Systems, Inc. proposes the program "Novel Thermosets For Room Temperature Cured Aerospace Composites." Aerospace composites must maintain integrity at 350F (177C). With current resin systems, this is only achievable through elevated cure cycling, translating to added costs throughout the manufacturing process and a reduced composite damage tolerance. To meet the challenge of high temperature performance with reduced processing costs and increased damage tolerance, Aspen proposes the development of a new class of epoxy resins amenable to room temperature curing. The proposed system initiates a close functional group packing density, allowing complete conversion at substantially below the polymers final glass transition temperature. The result is a high temperature, high strength polymer cured at room temperature with enhanced damage tolerance. Designed from the molecular level, this system represents the leading edge in epoxy functional monomer design research, and the maximum opportunity for significant cost reductions in aerospace quality composite fabrication. The Aspen Research and Development Team is comprised of world leading experts in computational molecular modelling, polymer, & material science, advanced composites, and aerospace engineering. Our external consultants included the Lockheed Fort Worth Company, Dr. Morton H. Litt of Case Western Reserve University and the Edison Polymer Innovation Corporation.
Small Business Information at Submission:
Principal Investigator:Mr. Patrick E. Mack
Aspen Systems, Inc.
184 Cedar Hill St Marlborough, MA 01752
Number of Employees: