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Device-Quality, Low-Defect Hybrid SiC Wafers

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
57589
Program Year/Program:
2003 / SBIR
Agency Tracking Number:
021ML-2658
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
ASTRALUX, INC.
2500 CENTRAL AVE. # 286 Boulder, CO 80301 2845
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2003
Title: Device-Quality, Low-Defect Hybrid SiC Wafers
Agency / Branch: DOD / USAF
Contract: F33615-03-C-5413
Award Amount: $749,972.00
 

Abstract:

Researchers at Astralux, Inc. in collaboration with PowerSicel, Inc and the University of Colorado at Boulder propose to develop hybrid SiC wafers using a novel technique. Specifically, our goal is to commercialize low-defect, epi-ready 3-inch and 4-inchSiC wafers. We will develop conducting substrates for both near-dc high voltage/power and optoelectronics, as well as semi-insulating wafers for RF power devices. Our hybrid SiC wafers are complementary to the existing bulk SiC wafers, and our value addedis to reduce stress, decrease defects, increase the production volume and significantly reduce the cost of larger-area substrates. During Phase I, researchers at Astralux demonstrated 35 mm hybrid SiC wafers with an epitaxial GaN growth demonstration. AllPhase I milestones were reached, the goals accomplished and we are now ready for prototype development in Phase II. In Phase II, the quality of the hybrid wafers will be validated through a SiC RF device demonstration.

Principal Investigator:

Randolph E. Treece
Vice President
3034131440
rtreece@astraluxinc.com

Business Contact:

Randolph E. Treece
Vice President
3034131440
rtreece@astraluxinc.com
Small Business Information at Submission:

ASTRALUX, INC.
2500 Central Ave. Boulder, CO 80301

EIN/Tax ID: 841195333
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No