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Company Information:
Name:
ThermAvant Technologies, LLC
Address:
1000 A Pannell Street
Columbia, MO
Columbia, MO
Located in HUBZone:
No
Woman-Owned:
No
Minority-Owned:
No
URL:
N/A
Phone:
(573) 239-4297
Award Totals:
Award List:
SBIR Phase I: Heat Spreader Using Nanofluid Oscillating Heat Pipes
Award Year / Program / Phase:
2009 / SBIR / Phase I
Agency:
NSF
Principal Investigator:
Peng Cheng, DEng
Award Amount:
$100,000.00
Abstract:
This Small Business Innovation Research (SBIR) Phase I proposal describes a heat spreader embedded with a nanolfuid oscillating heat pipe (OHP) that will meet the cooling needs of high power density electronics by utilizing: 1) the extra-high heat transfer coefficient of thin film evaporation; 2)… More
High Efficiency, JP-8 Fueled Refrigeration Cycles for Shelter Air Conditioning
Award Year / Program / Phase:
2010 / STTR / Phase I
Agency / Branch:
DOD / OSD
Research Institution:
University of Missouri-Columbia
Abstract:
The proposed JP-8 powered cooling technology was co-invented by ThermAvant Technologies, LLC and the University of Columbia-Missouri (MU). The technology is based on the ejector cooling cycle and has the following unique features: thermodynamically and fluid dynamically optimal working fluids for… More
Heat Actuated Cooling System
Award Year / Program / Phase:
2010 / SBIR / Phase I
Agency / Branch:
DOD / ARMY
Principal Investigator:
Joe Boswell, Co-founder, President
Award Amount:
$69,935.00
Abstract:
A cooling system that converts waste heat from power supply units into useful space cooling is sought by the U.S. Army to reduce the electrical loads and fuel consumption in mobile military platforms. Unfortunately, conventional heat actuated systems are too large and inefficient. ThermAvant… More
SBIR Phase I: High Efficiency Multi-fluid Jet Refrigeration
Award Year / Program / Phase:
2012 / SBIR / Phase I
Agency:
NSF
Principal Investigator:
Joseph A. Boswell
Award Amount:
$150,000.00
Abstract:
This Small Business Innovation Research Phase I project will demonstrate a highly efficient supersonic ejector vapor compression technology that converts low-to-medium grade thermal energy (200-400F) into useful refrigeration (20F-50F) at high condenser temperatures (100-120F). The proposed… More
Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics
Award Year / Program / Phase:
2012 / SBIR / Phase I
Agency:
DOD
Principal Investigator:
Peng Cheng, Thermal Engineer – (573) 239-4297
Award Amount:
$149,947.00
Abstract:
ABSTRACT: Miniature flat plate oscillating heat pipe (FP-OHP) heat spreaders using ThermAvant's patent-pending ThermalCircuit architecture and low CTE materials will be demonstrated in order to transfer 100-300W/cm2 from chip-sized heaters (1cm2 to 3cm2) to a heat sink area that rejects heat… More