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Company Information:

Company Name: ThermAvant Technologies, LLC
City: Columbia
State: MO
Zip+4: -
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phone: (573) 239-4297

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $699,824.00 6
SBIR Phase II $742,600.00 1
STTR Phase I $99,650.00 1

Award List:

SBIR Phase I: Heat Spreader Using Nanofluid Oscillating Heat Pipes

Award Year / Program / Phase: 2009 / SBIR / Phase I
Agency: NSF
Principal Investigator: Peng Cheng, DEng
Award Amount: $100,000.00
Abstract:
This Small Business Innovation Research (SBIR) Phase I proposal describes a heat spreader embedded with a nanolfuid oscillating heat pipe (OHP) that will meet the cooling needs of high power density electronics by utilizing: 1) the extra-high heat transfer coefficient of thin film evaporation; 2)… More

High Efficiency, JP-8 Fueled Refrigeration Cycles for Shelter Air Conditioning

Award Year / Program / Phase: 2010 / STTR / Phase I
Agency / Branch: DOD / OSD
Research Institution: University of Missouri-Columbia
Principal Investigator: Joe Boswell, President
Award Amount: $99,650.00
RI Contact: Hongbin Ma
Abstract:
The proposed JP-8 powered cooling technology was co-invented by ThermAvant Technologies, LLC and the University of Columbia-Missouri (MU). The technology is based on the ejector cooling cycle and has the following unique features: thermodynamically and fluid dynamically optimal working fluids for… More

Heat Actuated Cooling System

Award Year / Program / Phase: 2010 / SBIR / Phase I
Agency / Branch: DOD / ARMY
Principal Investigator: Joe Boswell, Co-founder, President
Award Amount: $69,935.00
Abstract:
A cooling system that converts waste heat from power supply units into useful space cooling is sought by the U.S. Army to reduce the electrical loads and fuel consumption in mobile military platforms. Unfortunately, conventional heat actuated systems are too large and inefficient. ThermAvant… More

SBIR Phase I: High Efficiency Multi-fluid Jet Refrigeration

Award Year / Program / Phase: 2012 / SBIR / Phase I
Agency: NSF
Principal Investigator: Joseph A. Boswell
Award Amount: $150,000.00
Abstract:
This Small Business Innovation Research Phase I project will demonstrate a highly efficient supersonic ejector vapor compression technology that converts low-to-medium grade thermal energy (200-400F) into useful refrigeration (20F-50F) at high condenser temperatures (100-120F). The proposed… More

Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Year / Program / Phase: 2012 / SBIR / Phase I
Agency: DOD
Principal Investigator: Peng Cheng, Thermal Engineer – (573) 239-4297
Award Amount: $149,947.00
Abstract:
ABSTRACT: Miniature flat plate oscillating heat pipe (FP-OHP) heat spreaders using ThermAvant's patent-pending ThermalCircuit architecture and low CTE materials will be demonstrated in order to transfer 100-300W/cm2 from chip-sized heaters (1cm2 to 3cm2) to a heat sink area that rejects heat… More

Thermal Management Improvements for Transmit/Receive Modules

Award Year / Program / Phase: 2013 / SBIR / Phase I
Agency / Branch: DOD / NAVY
Principal Investigator: Aaron Hathaway, Thermal Engineer – (773) 355-1653
Award Amount: $79,942.00
Abstract:
An oscillating heat pipe (OHP) embedded substrate made from low coefficient of thermal expansion (CTE) material(s) will be designed, simulated, optimized, fabricated, and empirically tested to demonstrate the OHP technology's ultra-high heat transfer rates under real-world microchip operating… More

Cylindrical Geometry Energy Storage Cooling Architectures

Award Year / Program / Phase: 2013 / SBIR / Phase I
Agency: DOD
Principal Investigator: Joe Boswell, President – (415) 264-0668
Award Amount: $150,000.00
Abstract:
ThermAvant Technologies, LLC and University of Texas at Arlington propose to design, model, fabricate and empirically test conformal fitting cylindrical energy storage heat cooling packages. ThermAvant will optimize cylindrical battery array cooling solutions that balance size, weight, coolant flow… More

Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Year / Program / Phase: 2014 / SBIR / Phase II
Agency / Branch: DOD / USAF
Principal Investigator: Peng Cheng, Senior Thermal Engineer – (888) 415-7306
Award Amount: $742,600.00
Abstract:
ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to transform high heat flux (e.g. 100-300W/cm2) at the device package to a lower heat flux at the heat sink… More
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