Abstract:Not Available Warhead technology could be furthered by a quantum step by incorporating electromagnetic pulse (EMP) effects. The EMP generating warheads would disrupt electronic countermeasure (ECM) devices or disable communications centers without the necessity of significant collateral damage. TPL… more
Abstract:Feasibility of fabricating IR window materials from aluminum nitride (AlN) will be demonstrated. Aluminum nitride windows are sought as replacements for sapphire windows on high speed seeker missiles because of their higher thermal shock resistance. Our approach is to consolidate high-purity… more
Abstract:The inability to deposit copper directly onto aluminum is a longstanding problem in microelectronic manufacturing. Presently, aluminum must be coated with a barrier layer such as TiN to promote copper adhesion and provide good electrical contact between the two metals. This work will demonstrate… more
Abstract:A long-standing trend in the integrated circuit industry is to reduce pattern geometries on semiconductor substrates. To continue this trend, the next exposure wavelength after on-going deep-ultraviolet (248 nm) will be 193 nm. This SBIR Phase I program will identify and develop thermosetting bottom… more
Abstract:Ion-implanted, thin polymer films exhibit a large temperature coefficient of resistance which suggests their application in microbolometer arrays used for infrared ( IR) imaging and temperature mapping. Compared to current microbolometer designs which require a series of difficult deposition steps,… more
Abstract:This proposal describes Phase I of a research and development program to develop and commercialize a compact, affordable Particulate Matter on-line, Real-time, Physical and Chemical Characterization and Monitoring System (PMCMS), that will quickly and accurately analyze the chemical constituents and… more
Abstract:Duke & Associates will develop a process/material modification for carbon fiber/vinyl ester composite materials which will provide enhanced fiber-matrix adhesion using a low cost, room temperature process such as resin transfer molding (RTM) or vacuum assisted RTM to manufacture high performance… more
Abstract:EPIC Technologies proposes to develop a flexible high density multichip assembly technology capable of being bent and twisted to conform to the available space in a constrained military of commercial electronic system. EPIC will adapt its basic chips first multichip assembly technology to meet the… more
Abstract:A recently patented connectionist paradigm, called the hine hose of thin film growth and removal. Trained by exposure to cumulative experimental data, this paradigm may autonomously compute processing routes toward… more
Abstract:Escherichia coli causes a number of serious poultry diseases, including colibacillosis resulting inmillions of dollars lost to the poultry industry each year. Contamination of poultry products bySalmonella is a major public health concern. Development of a bivalent poultry vaccine directedagainst… more
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