Abstract:The inability to deposit copper directly onto aluminum is a longstanding problem in microelectronic manufacturing. Presently, aluminum must be coated with a barrier layer such as TiN to promote copper adhesion and provide good electrical contact between the two metals. This work will demonstrate… more
Abstract:A long-standing trend in the integrated circuit industry is to reduce pattern geometries on semiconductor substrates. To continue this trend, the next exposure wavelength after on-going deep-ultraviolet (248 nm) will be 193 nm. This SBIR Phase I program will identify and develop thermosetting bottom… more
Abstract:Ion-implanted, thin polymer films exhibit a large temperature coefficient of resistance which suggests their application in microbolometer arrays used for infrared ( IR) imaging and temperature mapping. Compared to current microbolometer designs which require a series of difficult deposition steps,… more
Abstract:This proposal describes Phase I of a research and development program to develop and commercialize a compact, affordable Particulate Matter on-line, Real-time, Physical and Chemical Characterization and Monitoring System (PMCMS), that will quickly and accurately analyze the chemical constituents and… more
Abstract:Duke & Associates will develop a process/material modification for carbon fiber/vinyl ester composite materials which will provide enhanced fiber-matrix adhesion using a low cost, room temperature process such as resin transfer molding (RTM) or vacuum assisted RTM to manufacture high performance… more
Abstract:EPIC Technologies proposes to develop a flexible high density multichip assembly technology capable of being bent and twisted to conform to the available space in a constrained military of commercial electronic system. EPIC will adapt its basic chips first multichip assembly technology to meet the… more
Abstract:A recently patented connectionist paradigm, called the hine hose of thin film growth and removal. Trained by exposure to cumulative experimental data, this paradigm may autonomously compute processing routes toward… more
Abstract:Escherichia coli causes a number of serious poultry diseases, including colibacillosis resulting inmillions of dollars lost to the poultry industry each year. Contamination of poultry products bySalmonella is a major public health concern. Development of a bivalent poultry vaccine directedagainst… more
Abstract:Backplanes are key building blocks around which larger electronic systems are often implemented. They are designed so that the insertion of application derived function boards can use backplane paths for board-to-board communication. As systems grow, requiring more, higher-bandwidth paths,… more
Abstract:Production Products will develop microwave/RF heating or other directed energy heating techniques for the processing of thermoplastic composites and adhesive bonds with the support of our subcontractor Southern Research Institute and our aerospace mentor McDonnell Douglas Aerospace. Use of… more
Abstract:Production Products will develop novel, low cost liquid molding processing technology and in-situ fiber optic sensors for in-service process, health and dynamic response monitoring of monocoque or hybrid composite armor structural parts. Both fiber optic sensors and ultrasonic spectroscopy will be… more
Abstract:Production Products will design, develop, fabricate, and structurally evaluate a low-cost titanium alloy tow bar which will be significantly lighter, more durable and corrosion resistant, and cost competitive with the new M1 steel tow bar. We will be assisted in design of the tow bar and… more
Abstract:Production Products will develop a lightweight, modular, easily deployable barrier system that will be based on out proven polyurethane composite technology that has demonstrated the ability to absorb very high levels of elongation and energy without failure. This material can be elongated 500%… more
Abstract:Production Products will develop a new low cost, multiple performance, generic elastomeric machinery mount system which will provide varying static and dynamic vibration properties to allow vibration and shock isolation over a wide operation load range. Dr. Colin Ratcliffe, United States Naval… more
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