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Displaying 1 – 24 of 24 Awards
 
Company: Ultra Communications Inc Agency/Program/Year/Phase: DOE / SBIR / 2013 / 2
Abstract: …. The placement of fiber optic components within the ASIC assembly reduces the board level complexity and power consumption associated with the routing high speed signals over copper traces. To achieve this package integration, the component must be compatible with lead-free… more
Company: Ultra Communications Inc Agency/Program/Year/Phase: DOE / SBIR / 2012 / 1
Abstract: … of fiber optic components within the ASIC assembly reduces the board level complexity and power consumption associated with the routing high speed signals over copper traces. To achieve this package integration, the component must be compatible with lead-free solder… more
Company: Indiana Microelectronics LLC Agency/Program/Year/Phase: DOD / SBIR / 2010 / 1
Abstract: … a direct comparison of the environmental performance results of the novel epoxy attachment to the performance of a standard eutectic solder attachment. BENEFIT: The anticipated benifits of the study are the development and characterization of a low cost, novel, tin and lead… more
Company: TPF Enterprises LLC Agency/Program/Year/Phase: DOD / SBIR / 2010 / 1
Abstract: … will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free … more
Company: Privatran Agency/Program/Year/Phase: DOD / STTR / 2010 / 1
Abstract: … is tolerant to variations in manufacturing variable such as statistical variation in CNT heights. On the seed side, it is proposed to etch out the seed followed by polishing/CMP is proposed to eliminate that interface. We propose to investigate indium and a lead-free … more
Company: Ormet Circuits, Inc. Agency/Program/Year/Phase: DOD / SBIR / 2010 / 1
Abstract: The elimination of lead from most electronic assembly applications has had a number of repercussions. The low temperature alternatives suffer from detrimental performance and cost limitations. The high tin alloys have high process temperatures and a tendency to form tin whiskers, both of which have… more
Company: Accurate Automation Corporation Agency/Program/Year/Phase: DOD / SBIR / 2009 / 1
Abstract: Currently available soldering and heat gun systems have several significant deficiencies that can result in lower quality repairs and higher maintenance costs. The existing soldering irons naturally lead to cross-contamination between leaded and lead-free … more
Company: Creative Electron, INC Agency/Program/Year/Phase: NSF / SBIR / 2009 / 1
Abstract: … and characterize lead-free adhesives with very high thermal and electrical conductivity for wide bandgap semiconductor packaging. The company will build on its IP portfolio of fluxing adhesive binder systems to formulate polymer fluxes suitable for low-temperature, … more
Company: GCAS Incorporated Agency/Program/Year/Phase: DOD / SBIR / 2009 / 1
Abstract: This proposal describes the development of a specific technology for test-verified shock and vibration susceptibility analysis of lead free solder installations. The thrust of the work will be the development of a dynamic modeling… more
Company: Physical Optics Corporation Agency/Program/Year/Phase: DOD / SBIR / 2009 / 1
Abstract: To address the Navy need for a heat gun/soldering iron compatible with leaded and lead-free solders without risk of cross-contamination, and with all approved heat shrink and solder sleeves, for use in a Navy flightline maintenance environment, Physical… more
Company: Texas Research Institute Austin, Inc. Agency/Program/Year/Phase: DOD / SBIR / 2009 / 1
Abstract: Reliabilities of lead-free soldered assemblies and surface finishes are different from heritage tin-lead eutectic alloys when used in high-performance or long-lived military and aerospace applications. Single crystal, beta-tin whiskers have erupted… more
Company: METAMATERIA PARTNERS LLC Agency/Program/Year/Phase: NSF / STTR / 2007 / 1
Abstract: This Small Business Technology Transfer (STTR) Phase I Project is to develop a nanomaterials approach for a low temperature lead-free solder technology for heat-sensitive microelectronic, nanoelectronic and MEMS device that is based on the depression of the… more
Company: Quanterion Solutions Agency/Program/Year/Phase: DOD / SBIR / 2006 / 1
Abstract: … Materials Aging and Reliability," is developing tools to help in the SRP process. Sandia is using finite element analysis to simulate the effects of input variables of the solder characteristics and the environmental stresses over time to identify damage to the lead-free… more
Company: Faraday TechNology, Inc. Agency/Program/Year/Phase: NSF / SBIR / 2005 / 2
Abstract: … with the desired grain size, matte finish and control of internal stresses, to avoid whisker growth which can lead to component failure. The Phase II objectives/research tasks include: 1) pilot-scale facilities design and modification for electro-deposition of lead-free… more
Company: HYBRID PLASTICS Agency/Program/Year/Phase: NSF / STTR / 2005 / 2
Abstract: … components under different soldering methodologies, and in collaboration with solder suppliers and end users. A result of attempted adoption of lead-free solders has highlighted several adoption issues and concerns over service reliability of interconnects made with lead-free… more
Company: VEXTEC Corporation Agency/Program/Year/Phase: DOD / SBIR / 2005 / 1
Abstract: … material failure at either the board, interconnect or component level. VEXTEC proposes to extend JSF prognosis to digital electronics using a physics of failure and material microstructural modeling approach. This project will consider digital circuit failure due to lead-free… more
Company: Faraday TechNology, Inc. Agency/Program/Year/Phase: NSF / SBIR / 2004 / 1
Abstract: … with the desired grain size, matte finish and control of internal stresses, to avoid whisker growth which can lead to component failure. The Phase II objectives/research tasks include: 1) pilot-scale facilities design and modification for electro-deposition of lead-free… more
Company: REACTIVE NANOTECHNOLOGIES INC Agency/Program/Year/Phase: NSF / SBIR / 2004 / 2
Abstract: … damage to the components. The reactive bonding process is far more rapid than most competing technologies, and results in strong and cost-effective joints. The last and potentially most important benefit is the fact that joining with multilayer foils enables the use of lead… more
Company: MicroFab Technologies Inc Agency/Program/Year/Phase: NSF / SBIR / 2003 / 1
Abstract: …ct for the electronic industry. The ultimate goal of this technology is to develop a process that begins with a semiconductor integrated circuit (IC) with either aluminum (Al) or copper (Cu) bond pads and results in an IC ready for flip-chip bonding using lead-free … more
Company: Sysconn Corporation Agency/Program/Year/Phase: NSF / SBIR / 2003 / 1
Abstract: …silicon chips and wafers using a continuous wave carbon dioxide (CO2) laser. Optimum values of pertinent process parameters and the capability to produce high quality bonds at representative scales will be determined. The study will include both lead-tin solders and lead-free… more
Company: Texas Research Institute Austin, Inc. Agency/Program/Year/Phase: DOD / SBIR / 2003 / 2
Abstract: … of these materials and establishing new solderplatforms requires substantial and pervasive changes in the industry. As industry moves away from the use of lead in electronic assemblies, the development of qualification standards and reliability models for lead… more
Company: Texas Research Institute Austin, Inc. Agency/Program/Year/Phase: DOD / SBIR / 2002 / 1
Abstract: … and wetting characteristics of these materials and establishing new solderplatforms requires substantial and pervasive changes in the industry. As industry moves away from the use of lead in electronic assemblies, the development of qualification standards for lead … more
Company: Amalgamated Technologies Inc. Agency/Program/Year/Phase: NASA / SBIR / 1995 / 1
Abstract: N/A
Company: Ormet Circuits, Inc. Agency/Program/Year/Phase: DOD / SBIR / 1993 / 2
Abstract: …gains in solder joint strength exceeding 400% are anticipated. The objective is creation of a new solder substitute which exhibits superior strength though processed below 210 degrees Celsius to replace solder in electronic joints. The proposal also anticipates a lead free … more
Displaying 1 – 24 of 24 Awards
 
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