Award
Portfolio Data
Chemical Casualty Care: Wound Dressings Designed to Speed Wound Closure Following Debridement of Cutaneous Vesicant Injuries
Award Year: 2005
UEI: CAGMXNKG7XJ1
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Congressional District: 3
Tagged as:
SBIR
Phase I
Awarding Agency
DOD
Branch: ARMY
Total Award Amount: $110,000
Contract Number: W81XWH-06-C-0024
Agency Tracking Number: A052-131-1765
Solicitation Topic Code: A05-131
Solicitation Number: 2005.2
Abstract
QMT has technology in hand to develop a novel wound dressing that has potential to greatly enhance the rate of healing for debrided vesicant agent injuries, as well as related chronic wounds. The matrix of the dressing is based on a polyelectrolyte complex that consists of a highly absorbent anionic material (carboxymethyl cellulose, CMC) that is treated with a synthetic cationic polymer to enhance structural cohesion and to provide sustained release of a broad spectrum antibiotic (doxycycline) that also acts as an general inhibitor of metalloproteinases (MMPs and TNFa converting enzyme), which will reduce inflammation and proteases that retard wound healing. The polyelectrolyte complex matrix material is engineered to conform to the wound surface, and together with the backing layer of low moisture vapor penetration film, provide a moist wound healing environment. Further features of the dressing include controlled release of a growth factor (EGF) and antioxidants (vitamin C and E) that have been demonstrated to enhance the rate of wound healing. All ingredients are known to be robust, and the proposed dressing should have an indefinite shelf life without need for special storage conditions.
Award Schedule
-
2005
Solicitation Year -
2005
Award Year -
November 14, 2005
Award Start Date -
May 13, 2006
Award End Date
Principal Investigator
Name: Bernd Liesenfeld
Phone: (352) 379-0611
Email: bliesenfeld@quickmedtech.com
Business Contact
Name: Gerald M Olderman
Phone: (781) 271-9893
Email: jolderman@aol.com
Research Institution
Name: N/A