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ABL (Airborne Laser) Detection Sensor Improvements

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7503
Agency Tracking Number: B064-006-0046
Amount: $100,000.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA06-T006
Solicitation Number: N/A
Timeline
Solicitation Year: 2006
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-08-18
Award End Date (Contract End Date): 2007-02-12
Small Business Information
45 Manning Road
Billerica, MA 01821
United States
DUNS: 030817290
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Frank Iannarilli
 Principal Scientist
 (978) 663-9500
 franki@aerodyne.com
Business Contact
 George Wittreich
Title: Exec. Vice President
Phone: (978) 663-9500
Email: gnw@aerodyne.com
Research Institution
 UNIV. OF NOTRE DAME
 Shanda L Wirt
 
Office of Research 511 Main Bu
Notre Dame, IN 46556
United States

 (574) 631-8710
 Nonprofit College or University
Abstract

The first sentinel of ABL’s present target acquisition suite is a passive infrared search and track sensor of 1970s vintage, which we propose replacing with HyPAWS. HyPAWS is a low-cost passive wide-field of view staring sensor. Several such units suffice to provide full 360-degree view coverage. Leveraging revolutionary sensing techniques in ongoing development, HyPAWS offers advanced detection capabilities. In Phase 1, we will complete preliminary design of the HyPAWS sensor, flowing-down ABL operating, detection, and passive-to-active handover performance requirements. We will determine the most feasible Image-Stabilization-in-Silicon (ISiS) architecture to support HyPAWS processing. ISiS will implement the equivalent of 1000 COTS CPUs executing a specialized algorithm, on a small silicon chip. Our ISiS approach will trade principally between Cellular Nonlinear Network (CNN) chip, digital processing onboard a customized VLSI chip (e.g. “structured ASIC”), or digital processing onboard a customized read-out integrated circuit (ROIC) in concert with an FPA vendor. For full-scale Phase 2 fabrication of ISiS, we will employ our research institute partner (University of Notre Dame) nanofabrication facilities or MOSIS, or otherwise secure an industry partner to exploit envisioned synergistic technology combinations. In Phase 2, we will implement and field demonstrate a brassboard prototype HyPAWS sensor, employing our full-scale ISiS.

* Information listed above is at the time of submission. *

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