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Aerosol Jet Printing of Single-Wall Carbon Nanotube Transistors on Plastic Substrate

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-13-C-5172
Agency Tracking Number: F09B-T26-0152
Amount: $749,793.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: AF09-BT26
Solicitation Number: 2009.B
Solicitation Year: 2009
Award Year: 2013
Award Start Date (Proposal Award Date): 2013-01-22
Award End Date (Contract End Date): 2015-01-22
Small Business Information
3911 Singer NE
Albuquerque, NM -
United States
DUNS: 175348549
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Michael Renn
 Senior Scientist
 (651) 641-2850
Business Contact
 Dave Keicher
Title: Chief Technology Officer
Phone: (505) 761-8250
Research Institution
 University of Minnesota
 Pat Jondahl
450 McNamara Alumni Center 200 Oak Street S.E.
Minneapolis, MN 55455-5455
United States

 (612) 626-2244
 Nonprofit College or University

ABSTRACT: The goal of this phase II proposal is to develop a commercial platform for printing high performance, single-walled carbon nanotube transistor circuits on large-area plastic substrate. Automated processes will be developed for the room temperature printing of metal, semiconductor, and dielectric materials with micron-scale alignment accuracy. The transistor performance will be enhanced by optimizing the material formulations as well as optimizing the print features. Specifically, printed channel widths below 10 microns and gate dielectric thickness below 100 nm are targeted. This will potentially allow frequency performance in the GHz range. Many commercial and defense applications have already identified such as roll-up maps, RF antenna, and distributed sensor networks. The Optomec commercialization plan will leverage off already successful product launches where initially the market was seeded with R & D tools. Sales of production tools followed after a period of qualification and validation. BENEFIT: Example applications include roll-up maps, active matrix displays, sensor networks, arithmetic logic units, and rf antenna. The proposed printing system will be capable of fabricating circuits at low-cost and on large-area substrates.

* Information listed above is at the time of submission. *

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