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CMR Oxides Based Microbolometer Focal Plane Array with Reduced 1/f Noise

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911NF-09-C-0137
Agency Tracking Number: A09A-014-0317
Amount: $99,916.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: A09A-T014
Solicitation Number: 2009.A
Solicitation Year: 2009
Award Year: 2009
Award Start Date (Proposal Award Date): 2009-08-21
Award End Date (Contract End Date): 2010-02-17
Small Business Information
15 Cabot Road
Woburn, MA 01801
United States
DUNS: 004841644
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 King Wang
 VP of Material Technologies
 (781) 935-1200
Business Contact
 Rachel Carnes
Title: Manager Assistant
Phone: (781) 935-1200
Research Institution
 Los Alamos National Security
 Robert C Dye
Los Alamos National Laboratory PO Box 1663
Los Alamos, NM 87545
United States

 (505) 667-3404
 Federally Funded R&D Center (FFRDC)

We propose to realize a new class of microbolometer FPA technology with significantly reduced 1/f noise by replacing the sensing material (e.g. VOx) with colossal magnetoresistive (CMR) oxides. The program uniquely combines Agiltron’s experience in novel IR imager development and leading academic research on CMR at Los Alamos National Lab (LANL). The LANL Team has developed a breakthrough processing technique for CMR film deposition. Agiltron will further advance LANL’s CMR film fabrication techniques to reduce maximum processing temperatures, allowing formation of microbolometers on top of CMOS circuitry as practiced in current technology. We anticipate reducing the NETD of state of the art bolometers from 29 mK to 12 mK. In Phase I, the feasibility of the proposed approach will be demonstrated through developing a CMOS compatible fabrication process of CMR oxides. Microbolometer modeling, design and fabrication will be also performed. Functional microbolometers based on CMR oxides and a performance comparison with state of the art devices can be expected at the end of the program.

* Information listed above is at the time of submission. *

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