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Fast Curing Modular Composite Patch System for Field Applications

Award Information
Agency: Department of Defense
Branch: Special Operations Command
Contract: H92222-07-P-0074
Agency Tracking Number: S071-002-0129
Amount: $99,960.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: SOCOM07-002
Solicitation Number: 2007.1
Solicitation Year: 2007
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-08-16
Award End Date (Contract End Date): 2008-02-16
Small Business Information
34 Lexington Avenue
Ewing, NJ 08618
United States
DUNS: 096857313
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Andrew Kaufman
 Senior Associate
 (609) 538-0444
Business Contact
 Barbara Agans
Title: Administrator
Phone: (609) 538-0444
Research Institution

SOCOM requires a method to field repair multiple materials as well as to mount armor and related hardware for a variety of tactical purposes with a composite material. To address this need, we propose application of a “Modular UV Patch” (MUVP) system that incorporates ultraviolet curing resin systems and an innovative technique for delivering the UV light through optically lossy fibers that form a composite material. This patented modular patch system will be self-contained, easy to use, and provides rapid curing (seconds) while also providing a capability for underwater applications. The UV based resin systems offer increased shelf life, and elimination of special storage facilities, with a minimal “tail” of supporting equipment while maintaining the strength associated with both conventional thermal cures and competing bonding compounds. The focus of this Phase I effort is on the demonstration of a rapid strong single-step UV curing process and its assessment for damage tolerance and underwater adhesion as well as its optimization for a wide range of field applications. Comparisons with competitive sealant and adhesive compounds will also be made and an agenda determined for Phase II development of the MUVP system.

* Information listed above is at the time of submission. *

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