Flip Chip Hermetic Packaging of RF MEMS

RF MEMS technology, MEMS switches in particular, hold great promise for wireless communication and sensor systems. Military systems, such as RF seekers and ground-based radars, are the most likely first platforms for advanced RF MEMS. Excellent MEMSswitching devices have recently been developed, but because of packaging problems, no commercial integrated product exists. The objective of this proposal is to develop novel packaging concepts, design tools, demonstrated products for RF MEMS switches forKa and W band applications.CFDRC and Morgan Research will conduct conceptual and detailed design of hermetic, hybrid packaging concepts for RF MEMS microsystems. Advanced multiphysics CAD will be used to evaluate and optimize packaging design concepts and fabrication processes. Aprototype ceramic package will be fabricated with a MEMS switch on a CPW. The package will be experimentally tested at existing laboratories. In phase II the existing modeling and design tools will be integrated into an automated RF MEMS Packaging CAD andused for rapid design concept evaluation, optimization and analysis. Several new and optimized packaging concepts will be fabricated and tested in environmental chambers at existing laboratories. Joint packaging patents, standard testing procedures, RFMEMS packaging CAD, and commercial prototypes are just a few of project deliverables.The proposed project will result in comprehensive RF MEMS packaging CAD and new packaging concepts. New concepts of RF MEMS packaging will be commercialized. To US defense and communication markets. US military and defense industry will also benefit fromstandard test procedures for reliability, EMF/EMI, durability, and corrosion.