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FUNCTIONALLY GRADIENT ELECTRONIC HEAT SINK MATERIALS

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 12359
Amount: $49,963.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1990
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
Po Box 188 - 8270-b Cinder Bed
Lorton, VA 22079
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr Raymond J Weimer
 (703) 550-8044
Business Contact
Phone: () -
Research Institution
N/A
Abstract

RELIABILITY AND CIRCUIT DENSITY OF STANDARD ELECTRONIC MODULES (SEM) CAN BE INCREASED SIGNIFICANTLY BY TAILORING THERMOPHYSICAL PROPERTIES OF THE HEAT SINK MATERIALS. NEWLY DEVELOPED TECHNIQUES FOR MANUFACTURING METAL MATRIX COMPOSITES (MMC) BY VAPOR DEPOSITION METHODS WILL BE USED TO DEMONSTRATE LIGHT-WEIGHT, HIGH-PERFORMANCE HEAT SINKS HAVING THERAML CONDUCTIVITIES IN EXCESS OF 300 W/M-K AS WELL AS COEFFICIENTS OF THERMAL EXPANSION (CTE) OF 6-7 PPM PER DEGREE CELSIUS.

* Information listed above is at the time of submission. *

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