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Implantable Electrical Interconnects for Biosensors

Award Information
Agency: Department of Health and Human Services
Branch: National Institutes of Health
Contract: N/A
Agency Tracking Number: 1R43RR016123-01
Amount: $140,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
BOX 507, 10 E 4TH ST
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 () -
Business Contact
Phone: (716) 661-3623
Research Institution

DESCRIPTION (provided by applicant): A key issue for most implantable
micromachined sensor concepts being developed in the Neural Prosthetics Program
(NPP) at the National Institutes of Health (NIH) is how they are to be
interconnected with percutaneous connections or implanted telemetry units. A
robust, ultrafine, microribbon interconnect may enable many of today's advanced
biomedical sensor for clinical applications. The work proposed will focus on
developing a hydrolytically stable, corrosion resistant, fluoropolymer/silicone
composite ribbon cable to be used as a novel "Implantable Electrical
Interconnect for Biosensors." Two well-known classes of implantable materials,
silicones and fluoropolymers, will be combined in this effort. By coupling
innovative polymer surface modifications, a series of unique fluoropolymer
materials will be fabricated that will have exceptional surface adhesion
properties capable of forming strong bonds to both: (1) vacuum sputtered Au and
Pt metal and, (2) to commercially available silicone adhesives and coatings.
Using standard photo-resist based photolithography methods, conducting
micropathways of metal circuitry will be fabricated onto thin fluoropolymer
ribbons and then hydrolytically sealed via the covalent bonding of a Pt
catalyzed silicone material.
Based on results, these electrical interconnects (and cables) will have direct applications
into current technologies being developed within the NPP. Additionally, good results will also
demonstrate the effectiveness of these materials that will allow us to market the technology
into a variety of industrial applications that utilize electronic and microelectronic components
to be used in harsh, corrorsive environments currently under development within the
United States Military sensor programs.

* Information listed above is at the time of submission. *

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