You are here

Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

Award Information
Agency: Department of Defense
Branch: Army
Contract: DAAD19-02-C-0079
Agency Tracking Number: 44164-EL
Amount: $99,939.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
270 Littleton Road, Unit #29
Westford, MA 01886
United States
DUNS: 101719735
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Amaresh Mahapatra
 President
 (978) 392-7985
 amareshmahapatra@aol.com
Business Contact
 Amaresh Mahapatra
Title: President
Phone: (978) 293-7985
Email: amareshmahapatra@aol.com
Research Institution
 University Mass., Lowell Research Foundation
 Louise Griffin
 
600 Suffolk Street, 2nd Floor South
Lowell, MA 01854
United States

 (978) 934-4750
 Nonprofit College or University
Abstract

"The use of 3D, micromachined high resistivity silicon to fabricate high frequency RF circuits which are self packaged and hermetic has been successfully demonstrated. To incorporate optical components in the hermetic silicon package an equivalent opticalexit port from the hermetic package needs to be developed. We propose the demonstration of a compact, low cost, hermetic optical port using micromachined silicon for passive alignment of fibers and polymeric optical components to complement the RF hermeticports that have been successfully demonstrated in the literature. If successful, this proposal will demonstrate the ability to make a compact, low cost, hermetic optical port using micromachined silicon to complement the RF hermetic ports using siliconthat have been successfully demonstrated in the literature. Such an optical port is essential if 3D micromachined high density circuits are to reach their full potential for optoelectronic circuits. Will reduce cost of optical components manufacture byfactor of 10. For DOD applications this means the ability to deploy sophisticated optical networks in the field and on the individual soldier level."

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government