Multispectral Panoramic Imaging System

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNL06AA46P
Agency Tracking Number: 054803
Amount: $69,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solitcitation Year: 2005
Solitcitation Topic Code: X1.03
Solitcitation Number: N/A
Small Business Information
International Electronic Machines Corporation (IEM)
60 Fourth Avenue, Albany, NY, 12202-1924
Duns: 188282131
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Zack Mian
 Principal Investigator
 (518) 449-5504
Business Contact
 Ryk Spoor
Title: Business Official
Phone: (518) 449-5504
Research Institution
International Electronic Machines Corporation, a leader in the design of precision imaging systems, will develop an innovative multispectral, panoramic imaging system for use on exploratory landing craft. During Phase I, IEM will build upon and advance alternative strategies, including our patent pending Synthetic Field of View (SynthFOV) technology and our Pan/Tilt Mirror System (PTMS), initially conceived by IEM for the USMC Gladiator UGV. These two technologies will eliminate or significantly reduce the use of conventional moving parts, will decrease power demand, will reduce launch weight, and will require less space than current imaging systems. SynthFOV incorporates an array of Off-Axis Telescopes to focus light to a sensor via a series of optically precise mirrors. The PTMS uses a centrally configured mirror that rotates and tilts along both horizontal and vertical axes thereby directing the reflected light to a sensor. Alternative configurations include use of two imagers for stereo panoramic imaging; incorporating filter wheels for multispectral imaging on a single sensor; use of multiple sensors for imaging visible, near IR, and other wavelengths, and use of multispectral lenses to further reduce weight. IEM will evaluate these and other alternatives and will demonstrate the applicability of the selected approach through pre-prototype testing.

* information listed above is at the time of submission.

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