Optoelectronic Packaging for Through-Substrate Communications

ABJ Integration Technologies, Inc. proposes to model a vertically optically interconnected stack of silicon integrated circuits to form a three dimensional system. This 3D system will utilize through-substrate optoelectronic communication to which the package and silicon are optically transparent. System optimization for user specifications will include materials and components such as emitters and detectors, and transmitter and receiver circuits. Low cost foundry silicon CMOS will be used for all optoelectronic interface circuits. Thin film device integration will be used to bond the optoelectronic components directly onto the silicon interface circuits. Substrate package design and optical link optimization, including alignment tolerance analysis, will be an integral part of the model. Final designs will include a two layer stack of silicon integrated circuits which are laterally electrically connected on an MCM-type substrate, and are vertically optically interconnected. To alleviate the interconnection bottleneck in silicon integrated circuits, vertical optical interconnections will be developed to form three dimensionally interconnected systems. These systems will significantly increase the performance of massively parallel computational operations such as image processing, image generation, and "smart" systems.