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Reworkable Epoxy Bonding for Superconductor Multi-chip Modules

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-14-C-0077
Agency Tracking Number: N12A-014-0258
Amount: $719,751.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: N12A-T014
Solicitation Number: 2012.1
Solicitation Year: 2012
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-02-20
Award End Date (Contract End Date): 2016-06-14
Small Business Information
175 Clearbrook Road
Elmsford, NY 10523
United States
DUNS: 000000000
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Deepnarayan Gupta
 VP, RF Circuits and Syste
 (914) 592-1190
Business Contact
 Steve Damon
Title: Assistant Controller
Phone: (914) 592-1190
Research Institution
 University of Arkansas
 Dennis Brewer
210 Administration Building
Fayetteville, AR 72701-1201
United States

 (479) 575-3845
 Nonprofit College or University

HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. This was achieved in Phase I and will be further refined in Phase II to ensure high reliability and robustness. Furthermore, a new method of selective detachment and replacement of a single chip from an MCM will be developed in Phase II. MCMs of increasing complexity will be developed for different target naval applications including multi-input RF receivers.

* Information listed above is at the time of submission. *

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