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For the Phase I effort we plan to investigate two potential mutispectral sensor solutions a 3 color reticle system and 2 color imaging system. Each of these sensor soncepts will be analytically modeled and evaluated against the best set of target and background data that is available. This process will be used to identify minimum required sensor configurations in order to solve the Safe-To-Load (STL) problem. On a second vector, we plan to use available mechanical information regarding the sensor placement to start developing packaging concepts to deploy such a sensor so that we properly allow for important mechanical constraints in the design process. We will then use the results of these investigations to design an STL sensor that we will prototype using off the shelf components and test using phantoms that simulate the actual sensing problem.
* Information listed above is at the time of submission. *