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Shadow Moire System for Large Area Substrate Thermal Deformation Measurement

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 36487
Amount: $98,833.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
430 Tenth Street, Suite S-002
Atlanta, GA 30318
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Yinyan Wang
 (404) 881-1114
Business Contact
Phone: () -
Research Institution

Electronic Packaging Services (EPS) proposes to develop a commercial instrument for the experimental measurement of out-of-plane thermal displacements for large area electronic substrates. The system will be based on shadow moire, a full-field non-contact optical technique. Phase stepping analysis, which convolutes multiple moire fringe images with fixed phase differences between them, extends the resolution in out-of-plane displacement measurement below 0.1 mils, automatically identifies contour maxima and minima, and reduces interference from permanent optical features. The sample will be held within an oven combining radiant and convective heating to allow computer-controlled simulation of a variety of manufacturing and testing processes. This project is an extension of analytical services currently provided by EPS to electronics manufacturers. The Phase I objective is construction of a full-scale laboratory prototype. Specific technical aims include scaling equipment to 24" x 24" sample areas,increasing speed and robustness of automated analysis algorithms, demonstrating uniform temperature control over large samples, and identifying useful reporting formats for out-of-plane displacement information.

* Information listed above is at the time of submission. *

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