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Si Wires in Silicon-On-Insulator Configuration

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 28348
Amount: $60,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1995
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
4207 Montgomery Ne, Suites C&d
Albuquerque, NM 87109
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Saleem H. Zaidi
 (505) 899-4072
Business Contact
Phone: () -
Research Institution
N/A
Abstract

We propose a systematic investigation of crystalline Si structures as their dimensions are reduced to quantum sizes (5-10 nm). For convenience, we have chosen Si on insulator (SOI) material for optical and electrical characterization. Our nanofabrication approach relies on simple laser interferometric lithography techniques that are uniquely adaptable to large area manufacturing. Suitable application of wet-chemical etching and steam oxidation of Si have been used to form free-standing Si wires. SEM, Raman, PL, and electrical measurements are used to characterize Si wires as a function of their linewidth. Raman scattering shows large enhancement for 50-100 nm linewidths, and a splitting of the bulk mode for estimated 10-nm linewidths. Room temperature PL measurements from 10-nm structures show peaks varying from 530-630 nm. Electrical measurements in MSM configuration show significantly enhanced current response. A systematic investigation of these nm wire structures is proposed to determine PL correlation with crystal-size, and device performance in MSM and pn-junction configurations. Commercial applications include: 1. Si light sources for display applications, optical interconnects, 2. Si field-emission devices, 3. nm-linewidth Si devices, and 4. Si grating solar cells.

* Information listed above is at the time of submission. *

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