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Thermomechanical Characterization System for Mixed Technology Electronic Assemblies

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 36622
Amount: $98,833.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
430 Tenth Street, Suite S-002
Atlanta, GA 30318
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Yinyan Wang
 (404) 881-1114
Business Contact
Phone: () -
Research Institution

One approach to wider use of mixed mode technology requires polymer-based packaging materials, which place greater demands on the thermomechanical performance of the package design. Electronic Packaging Services (EPS) proposes to develop a commercial instrument for the experimental measurement of out-of-plane thermal displacements in populated mixed mode electronic assemblies. The system will be based on shadow moire, a full-field non-contact optical technique. Phase stepping analysis, which convolutes multiple moire fringe images with fixed phase differences between them, extends the resolution in out-of-plane displacement measurement below 0.1 mils, automatically identifies contour maxima and minima, and reduces interference from permanent optical features. The sample will be held within an oven combining radiant and convective heating to allow computer-controlled simulation of a variety of manufacturing and testing processes. This project is an extension of analytical services currently provided by EPSto electronics manufacturers. The Phase I objective is construction of a fully-functional laboratory prototype. Specific technical aims include increasing speed and robustness of automated analysis algorithms, handling regions occluded by components, cut-outs, and other features, demonstrating localized heating simulation approaches, and identifying useful reporting formats for out-of-plane displacement information.

* Information listed above is at the time of submission. *

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