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Toughened E-Beam Curable Resins for Low Cost, Rapidly Pultruded, Filament Wound and Resin Transfer Molded Composites

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 28745
Amount: $300,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1996
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
3 Vesbard Lane
Pepperell, MA 01463
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Thomas C. Walton
 (508) 433-9351
Business Contact
Phone: () -
Research Institution

The objective of the proposed program is to demonstrate the feasibility of an innovative, cost-effective, rapid-pultrusion composite processing technique and newly formulated resins which substantially reduce the need for expensive tooling, high puller tensions (dies are expected to be an order of magnitude shorter than conventional pultrusion dies) and slow thermal processing and can cure the composite in seconds (compared to minutes for thermal systems for an expected order of magnitude increase in line speed) at ambient or subambient conditions. The matrix polymers that make graphite-composites manufactured using this process possible are based on electron-beam curing of low viscosity Epoxy Functionalized Siloxane (EFS) polymers that have been shown to resist atomic oxygen, while exhibiting excellent mechanical and physical properties. This resin can be specially formulated with other low cost resins, toughener thermoplastic powers, and a proprietary low-dose-to-cure catalyst to lower the resins cost as well as improve on the already tougher-than-epoxy, hydrophobic, high Tg (>250 C) properties of the base resign. These composites are designed to be environmentally and hygienically friendly and outperform composites produced by competing fabrication techniques.

* Information listed above is at the time of submission. *

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