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Ultra-High-Heat-Flux Dissipation using Muti-Level Enhancement

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG6002C0050
Agency Tracking Number: 00-0345
Amount: $776,978.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2003
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
1291 Cumberland Ave, Suite G
West Lafayette, IN 47906
United States
DUNS: 809830557
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Terry Tope
 Principal Investigator
 (765) 494-5705
 mudawar@ecn.purdue.edu
Business Contact
 Issam Mudawar
Title: President
Phone: (765) 494-5705
Email: mudawar@ecn.purdue.edu
Research Institution
N/A
Abstract

Despite numerous recent developments in the area of thermal management, there is now a critical shortage of cooling schemes that can handle anticipated heat loads in many military and commercial applications. The lack of effective cooling schemes hasemerged as an obstacle to electronic packaging at the device, module, and system levels. This study incorporates liquid cooling techniques and capitalizes upon the merits of phase-change (boiling) to dissipate a broad range of heat fluxes corresponding tomodest increases in device temperature. By carefully controlling the liquid coolant temperature, it is possible to influence bubble volume, extend cooling potential, and simplify the coolant conditioning loop. Significant improvements in coolingperformance will be achieved by incorporating powerful surface enhancement techniques which influence heat dissipation on both the macro and micro scales. The Phase II study will exceed 1000 watts per square centimeter from a module containing a multitudeof heat sources in order to serve defense needs for decades to come. The Phase II study will also result in practical cooling hardware tailored to specific defense applications.The proposed work is anticipated to provide thermal management solutions for future defense and commercial electronic and power systems. Examples include spacecraft, high-power-density lasers, military avionics, superomputers, nuclear fusion reactors, andx-ray medical devices.

* Information listed above is at the time of submission. *

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