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Additive Manufacturing for Microwave Vacuum Electron Device Cost Reduction

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00253-16-P-0261
Agency Tracking Number: N16A-010-0166
Amount: $79,929.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N16A-T010
Solicitation Number: 2016.0
Timeline
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-08
Award End Date (Contract End Date): 2016-12-05
Small Business Information
1717 Stewart Street
Santa Monica, CA 90404
United States
DUNS: 140789137
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Pedro Frigola
 (310) 822-5845
 frigola@radiabeam.com
Business Contact
 Alex Murokh
Phone: (310) 822-5845
Email: murokh@radiabeam.com
Research Institution
 UC Davis
 Lien Pham
 
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING ONE SHIELDS AVENUE
Davis, CA 95616-5294
United States

 (530) 754-1079
 Nonprofit college or university
Abstract

The Department of the Navy has a need for the development of an additive manufacturing (AM) process for key vacuum electronic device components to meet on-demand, flexible, and affordable manufacturing requirements. The developed manufacturing method has a potential to reduce cost of vacuum electronics by as much as 70% as well as simplify and hence expedite production process of these devices by eliminating braze joints and thus also improve reliability. To demonstrate feasibility of the AM technology applied to vacuum electronics: during the Phase I effort a sample RF circuit structure will be built and a technique for printing metal to ceramic seals will be developed; during the Phase II effort, a full coupled cavity travelling wave tube (TWT) structure attached to two ceramic isolators on both ends will be built and demonstrated for RF performance (cold test), high voltage isolation, and ultra-high vacuum holding capability. This approach will also demonstrate the capability of single-step production of complex systems confirming clean and full density material conditions, mechanical tolerance, and surface roughness requirements. In addition, this development will also open opportunities for improved thermal management designs for RF circuit cavities as well as for more advanced RF circuit cavity designs.

* Information listed above is at the time of submission. *

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